HeFei GuoFeng Advanced Basic Materials
Technology Co
Anhui Guofeng New Materials Co., Ltd., a state-owned listed new
materials enterprise under Hefei Municipal Government, has been
deeply committed to five major industries since its establishment:
polymer functional film materials, optoelectronic new materials,
polyimide materials, green and environmentally friendly
wood-plastic new materials, and new lightweight materials for new
energy vehicles. Integrating R&D, procurement, production, and
sales into a comprehensive system, the company's product quality
ranks among the top in the industry.
PI film, commonly known as the "gold film" in the industry, is one
of the polymer materials with the best comprehensive performance.
It exhibits excellent properties such as high insulation, high heat
resistance, high strength, and high radiation resistance, earning
it the reputation as a "problem-solving expert." Alongside carbon
fiber and aramid fiber, PI film is recognized as one of the three
bottleneck polymer materials restricting the development of China's
high-tech industries. Its products are primarily used in high-tech
fields such as power and electrical engineering, energy and
transportation, 5G communication, electronic information,
aerospace, and more.
The PI project is a key industrial initiative for Guofeng New
Material's industrial transformation and upgrading. In March 2019,
Guofeng New Material established a Polyimide Branch, which
successively built and put into operation four thermal production
lines in the Hefei High-Tech Zone. To further expand production
scale and diversify the product portfolio, Guofeng New Material
invested 600 million yuan in May 2021 to register and establish
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. This
new company is constructing seven thermal production lines and one
chemical production line (imported) in the Hefei Xinzhan District.
With a total PI film production capacity of 1,600 tons, Guofeng
ranks among the top domestic producers.
The company boasts a team of highly qualified technical and
managerial professionals, adhering to a combination of independent
innovation and industry-academia-research collaboration. It has
established multiple experimental facilities, including a PI
synthesis laboratory and a PI pilot production line. Additionally,
the company has set up joint laboratories with the University of
Science and Technology of China and Harbin Institute of Technology,
focusing on PI frontier technologies and critical challenges. These
collaborations aim to advance key core technologies and
industrialize PI materials for applications in flexible circuits,
flexible displays, integrated circuit packaging, and other fields.
The company has successfully overcome multiple key technologies in
PI product preparation, with several electronic-grade PI films
achieving mass production and gaining widespread customer
recognition. This has effectively addressed the long-standing
"bottleneck" issue of China's reliance on imported high-end PI
films.
To date, the company holds 28 authorized invention patents and 27
authorized utility model patents for its polyimide films. The
Guofeng PI project has been included in Anhui Province's key
manufacturing initiatives for addressing shortcomings in
industry-academia-research applications and critical common
technology breakthroughs, as well as in Hefei's strategic new
materials industry plan. In 2022, the company was recognized by the
Hefei Development and Reform Commission as a key enterprise in the
new display industry chain. The polyimide films produced by the
company have obtained UL certification in the United States, and
among them, the "GB-type polyimide black film for precision circuit
boards" has been selected for the first batch of new materials list
in Anhui Province.
Our Key Application Areas:
1. Flexible Electronics & Displays
Application: As a cornerstone material for flexible printed circuits (FPCs) and
substrates for flexible displays.
Value Proposition: Our ultra-thin and durable PI films provide the robust yet
flexible base required for bendable, foldable, and rollable
devices. This is critical for smartphones, wearable technology, and
next-generation displays.
2. Advanced Integrated Circuit (IC) Packaging
Application: Used as coverlay films, stress buffers, and substrates in
semiconductor packaging, including Fan-Out Wafer Level Packaging
(FOWLP) and Chip-on-Film (COF).
Value Proposition: Our films deliver superior dimensional stability, low coefficient
of thermal expansion (CTE), and excellent dielectric properties,
ensuring reliability and enhancing performance in miniaturized and
high-density ICs.
3. Precision Circuit Boards
Application: Specifically, our "GB-type PI Black Film" is designed for
high-precision circuit boards.
Value Proposition: This specialized black film prevents light interference during
assembly, is laser-markable, and offers the same unmatched thermal
and chemical resistance. It ensures high yield and reliability in
sophisticated consumer electronics and communication equipment.
