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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. A Leader in the Film Industry

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Engineered Copper-Polyimide Laminate for Flexible Circuits

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
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    Buy cheap Engineered Copper-Polyimide Laminate for Flexible Circuits from wholesalers
     
    Buy cheap Engineered Copper-Polyimide Laminate for Flexible Circuits from wholesalers
    • Buy cheap Engineered Copper-Polyimide Laminate for Flexible Circuits from wholesalers
    • Buy cheap Engineered Copper-Polyimide Laminate for Flexible Circuits from wholesalers
    • Buy cheap Engineered Copper-Polyimide Laminate for Flexible Circuits from wholesalers
    • Buy cheap Engineered Copper-Polyimide Laminate for Flexible Circuits from wholesalers

    Engineered Copper-Polyimide Laminate for Flexible Circuits

    Ask Lasest Price
    Brand Name : Guofeng
    Model Number : 25um
    Certification : SGS Reach ROHS
    Price : $300-$30000
    Payment Terms : L/C,T/T
    Supply Ability : Negotiation
    Delivery Time : 7 Working Days
    • Product Details
    • Company Profile

    Engineered Copper-Polyimide Laminate for Flexible Circuits

    Engineered Copper-Polyimide Laminate for Flexible Circuits
    Product Overview:

    The GL series redefines the performance standard for polyimide film technology. Our proprietary biaxial stretching process creates a uniquely molecularly oriented structure, delivering greater than 30% enhancement in critical properties—from tensile strength and dimensional stability to chemical resistance—when benchmarked against conventional films. This high-performance, natural yellow polyimide film is available in customized thicknesses, establishing it as the material of choice for the most demanding applications, including high-reliability adhesive substrates and advanced chip packaging.

    Place of Origin:
    ANHUI, CHINA
    Material:
    Polyimide
    Color:
    Yellow
    Treatment:
    Single-side / Both Sides
    Width:
    514MM, 520MM, 1028MM, 1040MM
    Thickness:
    custom
    Packaging:
    vacuum packaging
    Supply Ability:
    2000 ton/year
    Product Features:

    Outstanding Mechanical Strength

    Exceptional Dimensional Stability

    Superior Laminating Properties

    Conforms to RoHS and REACH regulations


    Product Applications:

    The GL high-performance polyimide film is primarily used in:

    High-precision adhesive FCCL substrates

    High-stability cover films

    Chip packaging

    Special adhesive tape substrates


    Handling & Storage Instructions:

    To ensure the longevity and performance of our Polyimide film:

    • Shelf Life: 6 months from the date of manufacture
    • Storage Conditions:
      • Store in a cool, dry place away from direct sunlight
      • Avoid exposure to high humidity or extreme temperature fluctuations
    Product Images:

    Engineered Copper-Polyimide Laminate for Flexible Circuits

    Engineered Copper-Polyimide Laminate for Flexible Circuits

    Engineered Copper-Polyimide Laminate for Flexible Circuits

    Engineered Copper-Polyimide Laminate for Flexible Circuits

    Company Image:

    Engineered Copper-Polyimide Laminate for Flexible Circuits

    Engineered Copper-Polyimide Laminate for Flexible Circuits

    Quality Engineered Copper-Polyimide Laminate for Flexible Circuits for sale
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