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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. A Leader in the Film Industry
1 Years
| Ask Lasest Price | |
| Brand Name : | Guofeng |
| Model Number : | 7.5um |
| Certification : | UL ISO ROHS |
| Price : | $300-$30000 |
| Payment Terms : | L/C,T/T |
| Supply Ability : | Negotiation |
| Delivery Time : | Negotiation |
This revolutionary polyimide substrate incorporates proprietary molecular alignment technology and ceramic nano-reinforcements to achieve unprecedented dimensional stability (±0.01% dimensional change under 85°C/85% RH), representing a 60% improvement over conventional polyimide substrates. Designed for advanced flexible electronics requiring sub-micron registration accuracy, it maintains exceptional circuit integrity through 3000+ thermal cycles (-65°C to 280°C) while delivering 50% enhanced adhesion strength and 40% reduced moisture absorption for next-generation high-density interconnects.
Sub-Micron Dimensional Stability
±0.01% dimensional change after 2000 hours at 85°C/85% RH (60% improvement vs. standard PI films)
Ultra-low CTE 1.5-2.0 ppm/°C (X/Y axis) precisely matched to silicon and gallium arsenide
Near-zero hygroscopic expansion coefficient <0.005% (70% reduction vs. conventional substrates)
Extended Mechanical Endurance
55% higher tear strength retention after thermal aging at 200°C for 5000 hours
Withstands 2,000,000 dynamic flex cycles at 0.3mm bend radius
Peel strength >10 N/cm after multiple lead-free reflow processes at 260°C
High-Frequency Electrical Performance
Dielectric constant (Dk) 3.0 ± 0.01 across 1-60 GHz frequency range
Dissipation factor (Df) <0.001 after 1000 hours humidity resistance testing
Volume resistivity >10¹⁸ Ω·cm at 300°C
Advanced Manufacturing Compatibility
Laser drillable with 5μm microvia capability for ultra-HDI circuits
Compatible with extreme thin copper foils (≤1μm) for 5μm line/space patterning
Chemical resistance to all known PCB processing chemicals and solvents
Advanced Flexible Electronics
Ultra-high density flex circuits for medical imaging and diagnostic systems
Multi-layer rigid-flex boards for aerospace and satellite systems
2.5D/3D semiconductor packaging interposers requiring sub-micron alignment
Precision Instrumentation Systems
Quantum computing and photonic integration circuits
Autonomous vehicle LiDAR and vision systems
Aerospace guidance and navigation systems
Next-Generation Electronics
Foldable and rollable display electronics
Implantable medical devices and biosensors
Advanced automotive radar and communication systems
This substrate represents a paradigm shift in flexible circuit materials technology by achieving semiconductor-level dimensional stability through proprietary molecular engineering. The integration of quantum dot reinforced technology and crystalline alignment control enables unprecedented performance in ultra-high density flexible circuits, overcoming traditional limitations in registration accuracy and reliability. This breakthrough enables flexible circuit designs with feature sizes previously only achievable in rigid substrates, opening new possibilities for advanced electronic packaging and miniaturization.
To ensure the longevity and performance of our Polyimide film,
please adhere to the following guidelines:
· Store in a cool, dry place away from direct sunlight will be
necessary.
· Avoid exposure to high humidity or extreme temperature
fluctuations.
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