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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

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OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging

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    Buy cheap OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging from wholesalers
     
    Buy cheap OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging from wholesalers
    • Buy cheap OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging from wholesalers
    • Buy cheap OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging from wholesalers

    OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging

    Ask Lasest Price
    Brand Name : Guofeng
    Model Number : 7.5um
    Certification : SGS ROHS
    Price : $300-$30000
    Payment Terms : L/C,T/T
    Supply Ability : Negotiation
    Delivery Time : Negotiation
    • Product Details
    • Company Profile

    OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging

    GL-7.5 Ultra-thin Polyimide Yellow Film
    Our GL series is a biaxially oriented, natural yellow polyimide film, independently developed and manufactured. It is offered in three distinct thicknesses and formulations, primarily for use in adhesive substrates and chip packaging applications.
    Key Advantages:

    Engineered for excellence, this advanced material delivers unmatched mechanical integrity, electrical insulation, and heat resistance. It ensures superior bonding adhesion for reliable assembly and is certified to meet global environmental (RoHS/REACH) and safety (UL) standards.


    Product application:
    GL standard polyimide film serves as an essential manufacturing element for flexible printed circuit coverlays, high-density connectors, and advanced insulating tapes.
    Place of Origin:
    ANHUI, CHINA
    Certification:
    SGS, FDA
    Material:
    Polyimide
    Color:
    Yellow
    Width:
    514MM, 520MM, 1028MM, 1040MM.etc
    Thickness:
    7.5μm
    Packaging:
    Wooden pallet
    Product Features
    This material exhibits exceptional mechanical properties, including high tensile strength and durability, along with outstanding dimensional stability attributable to its extremely low coefficient of thermal expansion (CTE). It is characterized by superior adhesion for secure integration and is verified to be fully compliant with international RoHS and REACH environmental regulations. The product also holds safety certification from Underwriters Laboratories (UL).
    Product Applications

    GL high-performance polyimide film functions as a fundamental component in next-generation electronics, delivering essential performance characteristics for precision adhesive FCCLs, dimensionally stable coverlays, advanced semiconductor packaging, and specialized tape applications.

    Product Images
    OEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip PackagingOEM Polyimide Film Roll Yellow For Adhesive Substrates And Chip Packaging


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